Computer Programming MCQs

A. Copper points offer low contact resistance
B. Copper can be easily soldered and welded
E. Copper windings are less bulky and the machines become compact
D. All of the above

A. Less liability to kink
B. Greater flexibility
C. Less liability to break
D. All of the above

A. Insulators
B. Conductors
C. Semiconductors
D. Superconductors

A. Solubility
B. Viscosity
C. Porosity
D. Hygroscopicity

A. Positive ions only
B. Negative ions only
C. Positive and negative ions
D. Electrons and holes

A. Temperature
B. Resistance
C. Eddy currents
D. Coupling co-efficient

A. Tungsten
B. Aluminium
C. Copper
D. Carbon

A. Both have great tendency for oxidation
B. Both have low melting point
C. Very large length of wires will be required
D. All of the above

A. Phosphorous
B. Rubber
C. Silicon
D. Aluminium

A. Diamond
B. High speed steel
C. Mild steel
D. Cast iron